microelectronic packaging
英 [ˌmaɪkrəʊɪlɛkˈtrɒnɪk ˈpækɪdʒɪŋ]
美 [ˌmaɪkroʊɪlɛkˈtrɑnɪk ˈpækɪdʒɪŋ]
网络 微电子封装
双语例句
- Study on Electroless Ni-P Film Plating in Microelectronic Packaging
微电子封装中化学镀Ni-P薄膜研究 - Application, process control and solution of stored-energy welder in microelectronic packaging field are introduced.
主要介绍储能焊机在微电子封装领域的应用、工艺控制及解决措施。 - Large Area Hybrid& An Advanced Microelectronic Packaging Concept
大面积混合电路&一种先进的微电子组装概念 - Anisotropic conductive adhesive ( ACA) is a kind of new and environment friendly interconnected materials in the field of microelectronic packaging, and it is widely used in electronic products.
各向异性导电胶作为一种新兴的绿色环保微电子封装互连材料，广泛应用于电子产品中。 - The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging
微电子封装用各向异性导电胶膜的研究进展 - Three Levels Microelectronic Packaging Technology
T.三级微电子封装技术 - So it is necessary to research and develope the advanced microelectronic packaging to replace the conventional electronic packaging.
为此，必须研究采用先进的微电子组装技术取代落后的常规电子组装技术。 - A Rapid Prediction Method of the Microelectronic Packaging Temperature Junction
一种快速的微电子封装结温预测方法 - Chip scale package ( CSP) is a new microelectronic packaging technology rapidly deve-loped in recent years.
芯片尺度封装（CSP）技术是近年来发展最为迅速的微电子封装新技术。 - The paper introduces many questiones of BGA-a new microelectronic packaging technology, including basic concept, features, packaging types, production and applicationes.
概括介绍了新型微电子封装技术&BGA的基本概念、特点、封装类型、最新进展、生产应用等。 - It is noted that microelectronic packaging technology becomes one of the most important and challenging technologies in radar and all other electronic products.
令人瞩目的是微电子组装技术正在成为现代雷达及其他电子设备中最重要的关键技术之一。 - 3-D Multichip Module ( MCM) is the developing trend of microelectronic packaging in the future.
3-D多芯片组件（MCM）是未来微电子封装的发展趋势。 - Chip scale package ( CSP) is a new microelectronic packaging technology rapidly developed in recent years Four types of CSP devices are described and fabrication technologies for each of them are analyzed in the paper
芯片尺寸封装（CSP）技术是近年来发展最为迅速的微电子封装技术之一。文章介绍了目前出现的四类CSP结构形式，分析了每种结构的工艺技术特点及其制作方法 - The techniques and application of electroless Nickel Plating on Microelectronic packaging was researched.
本文对微电子封装化学镀镍生产工艺及应用进行了研究。 - Based on response boundary finite element method, the paper builds a rapid and accurate method of predicting temperature junction of the microelectronic packaging.
本文基于响应面有限元法，建立了一种快速、准确预测微电子封装结温的方法。 - The designs principles and methods of microelectronic packaging are discussed in this paper. Several examples of microelectronic packaging are reviewed for its application in radar.
本文论述了微电子组装的设计原则及各种微电子组装方法，列举了14个国内外微电子组装在雷达中应用的例子。 - The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
就应力&应变场有限元数值模拟在微电子组装焊点可靠性研究中的应用进行了综述。 - The microelectronic packaging technology is an important technology that affects performance, size, price and reliability of final electronic products.
微电子封装技术是一项重要的技术，这项技术直接影响最终电子产品的性能、外形尺寸、价格及可靠性能。 - Third, three orders; Three Levels Microelectronic Packaging Technology
第三，三个级；三级微电子封装技术 - New Microelectronic Packaging Technology-BGA
新型微电子封装技术&BGA - Using self-assembly in microelectronic packaging technology, huge advantage can be gained to satisfy the market requirements of sophisticated electronic devices.
将自装配技术用于微电子封装之中，可有效提高技术的先进性，顺应现代社会高端电子产品的需求。 - Study on the Shear Testing of Sn-Ag-Cu Solder Joint in Microelectronic Packaging
微电子封装中Sn-Ag-Cu焊点剪切强度研究 - Microelectronic packaging is generally devided into three levels packaging. SCM and MCM are the first level packaging, are called chip level packaging;
微电子封装一般可分为三级封装，即用封装外壳（金属、陶瓷、塑料等）封装成单芯片组件（SCM）和多芯片组件（MCM）的一级封装，常称芯片级封装； - Research status of reflow soldering technology in microelectronic packaging and assembly
微电子封装与组装中的再流焊技术研究进展 - With the development of microelectronic packaging technology and the rise of green electronic industry, anisotropic conductive adhesive film ( ACF) has attracted more and more attention as a new kind of green packaging interconnect materials.
随着微电子封装技术的发展及绿色电子工业的兴起，各向异性导电胶膜（ACF）作为一种新兴的绿色封装互连材料，日益受到电子工业和研究者的广泛关注。 - Because of excellent electrical conductivity and thermal conductivity copper and its alloys have become important interconnect material, widely used in large scale integrated circuit chip, microelectronic packaging, MEMS, solar cells and other devices.
由于铜具有优良的导电、导热性能，目前已经成为互连线的重要材料，广泛应用于大规模集成电路芯片、微电子封装、微型机电系统、太阳能电池等设备中。 - So far, without any kind of the lead-free solder which performance can exceed the position of Sn-Pb solder in the microelectronic packaging. There is still a large difference between the lead-free solders and Sn-Pb solders on the soldering properties and solder joint reliability.
至今为止，没有任何一种无铅钎料的性能能够超越Sn-Pb钎料在微电子封装中的地位，无铅钎料的焊接性能和焊点可靠性方面与Sn-Pb钎料还相差很大。 - In microelectronic packaging, solder joints are used not only for chip-level flipchip ( FC) packaging technology, but also widely used in board-level, ball grid array ( BGA) packaging technology.
在微电子封装中，焊锡接点互连不仅用于芯片级的倒装芯片（FC）封装技术，而且广泛用于电路板级封装的球栅阵列（BGA）封装技术。 - Undestructive inspection is an important technique in the reliability study on the microelectronic packaging. The undestructive inspection of high frequency ( 230MHz) scanning acoustic microscopy ( SAM) is applied in our experimental study.
无损检测是微电子封装可靠性研究领域的重要手段，本实验过程中使用高频（230MHz）声学显微镜进行无损检测。 - With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
随着微电子封装焊点尺寸的微型化，微连接尺寸效应对焊点的本构方程产生不可忽视的影响。